PU foam base with copper-nickel plated conductive fabric, surface resistance as low as 0.05Ω/sq, high compression ratio, excellent resilience and durability. Ideal for EMI shielding in structural gaps.
Made from conductive fabric, foam, and adhesive. Customizable cross-sections for 360° EMI shielding and grounding.
Used in display frames, housing joints, and grounding replacements. High-temperature resistance and stable high-frequency shielding, suitable for diverse electronic devices.